1 Test Purpose
X-ray inspection is a method of detecting the internal defects of a sample by X-rays using the ray intensity after attenuation of each part of the sample, depending on the difference in X-ray absorption rate and transmittance between different parts of the sample.
X-ray is key using as following:
- Inner line open or short
- Adhesive issue
- Package crack and void
-Soldering issue
…
X-RayCategory: 2D X-ray and 3D X-ray (CT)
2 Test Objectives
- Electronica Component
- PCBA Soldering
3 Typical Case Study
2D X-Ray Inspection Photo
3D X-Ray Inspection Photo
4 Test Effect:
(1) Batch Quality Uniformity Inspection
(2) Key Process Quality Monitoring
(3) Delivery Component Inspection and Sampling
(4)Out of Storage Re-inspection and Sampling
(5) Daily Inspection or Application Inspection
(6) Identifying and re-New component Assessment
(7) Components Reliability Screening and Qualification
(8) Quality Analysis and Comparison
(9) Control the related process failure mode during Design and Production
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