PCB/PCBA Failure Analysis

 

1 Purpose

    In order to ensure and improve the quality and reliability of electronic products, the failure analysis must be performed on failed samples, to find the root cause of product failure, and through the implementation of targeted improvement. 

2 Key Failure Mode (But no limited)

    Poor soldering                     Bending deformation       Corrosion or migration

    Determination / Blister         Open Circuit                    Short Circuit      

3 Failure Analysis Technology Method

    Appearance Inspection         Thermal analysis         SIMS

    X-Section                               C-SAM                        FT-IR

    X-Ray                                     FIB                             Failure Simulation Analysis

    Dry & Pry                               SEM & EDS                TEM 

4 Benefits

   - Identify the reason of the failure, provide the evidence for product design, material optimization and process improvement;

   - Clearly the responsible of failure reason, and provide the evidence for judicial arbitration. 

5 Case Study 

            PCB Poor Soldering (chemical nickel)