Component
Position:Home > Component

                                                    Electronic Component Failure Analysis 


1 Failure Analysis Flow Chart 

   

2 Failure Analysis Application

    (1) The analysis objects including that have failed or have undergone significant changes for component, product in design, production and end-use (field) stage.

    (2) Design, process and test screen optimization in design stage. 

    (3) The selection of components, optimization of secondary screening conditions, control measures of fault control in the production of the equipment, reliability growth, and whole life period maintenance, etc.  

3 Case Study

  

                                   Fig.1: C-SAM & SEM find out IC Bonding pad taken-off

  

                              Fig. 2: DECAP and SEM found the Small voltage breakdown of IC




公众号

Add.(Office):16th Floor, Building AB, Southern Securities Building, No. 2016 and 2018 Jianshe Road, Jiabei Community, Nanhu Street, Luohu District, Shenzhen City, Guangdong Province

Tel.: +86-769-22247299 E_mail: Service@itstlab.com

Add.(Laboratory):1F, no.278, wentang shiyang street, dongcheng district, dongguan, guangdong.

Tel.: +86-769-22247299 E_mail: Service@itstlab.com

Add.: 407, 3 building, No. 3, Science Avenue,Guangzhou Science Park,Guangzhou City,P.R.China.

Tel.: +86-20-29862950 E_mail: Service@itstlab.com