C-SAM Test

1 Test Purpose

    The purpose of this examination is to nondestructively detect unbonded regions and voids in the die attach material of semiconductor devices through the measure of acoustic continuity. It establishes methods and criteria for ultrasonic inspection of semiconductor devices.

    The ultrasonic generator, receiver, and line scan recorder settings (when used) shall be selected or adjusted as necessary to obtain satisfactory images and achieve maximum image details within the sensitivity requirements for the device or defect features the test is directed toward. In the case of reflection mode or transmission mode images, care must be exercised to insure that the ultrasound penetrates and is sensitive to the entire die attach interface.

2 Test Objectives and Principle

    Plastic Package and semiconductor Component

                                                       Fig. 1: Test Principle

3 Typical Case Study

                               Fig. 2: Case Study 

4 Test Effect

  (1) Batch Quality Uniformity Inspection

  (2) Key Process Quality Monitoring

  (3) Delivery Component Inspection and Sampling

  (4) Out of Storage Re-inspection and Sampling

  (5) Daily Inspection or Application Inspection

  (6) Identifying and re-New component Assessment

  (7) Components Reliability Screening and Qualification 

  (8) Quality Analysis and Comparison

  (9) Control the related process failure mode during Design and Production