1 Test Purpose
The purpose of this test is to determine the effectiveness (hermeticity) of the seal of microelectronic and
semiconductor devices with designed internal cavities.
The leak separates two kinds that one is gross leak, and another is fine leak, the gross leak is used the bubble test method, and fine leak is used the tracer gas helium (He) and radioisotope test method.
2 Test Objectives
Sealing Package Structure Component
3 Typical Case Study
4 Test Effect
(1) Batch Quality Uniformity Inspection
(2) Key Process Quality Monitoring
(3) Delivery Component Inspection and Sampling
(4)Out of Storage Re-inspection and Sampling
(5) Daily Inspection or Application Inspection
(6) Identifying and re-New component Assessment
(7) Components Reliability Screening and Qualification
(8) Quality Analysis and Comparison
(9) Control the related process failure mode during Design and Production
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