Inner Inspection

1 Test Purpose

    According to the De-cap method to inspect the component internal structure and surface morphology, the technical method of inspecting the inner of the plastic package microcircuit is often applied, which is a destructive physical analysis.   

De-capCategory: Chemical and Mechanical De-cap.

2 Typical Case Study

               The inner of IC De-cap                              Micropscope Insepction 

3 Test Effect

 （1) Batch Quality Uniformity Inspection

 （2) Key Process Quality Monitoring

 （3) Delivery Component Inspection and Sampling

 （4) Out of Storage Re-inspection and Sampling

 （5) Daily Inspection or Application Inspection

 （6) Identifying and re-New component Assessment

 （7) Components Reliability Screening and Qualification

 （8) Quality Analysis and Comparison

 （9) Control the related process failure mode during Design and Production