PIND (Particle Impact Noise Detection）

1 Test Purpose

    The purpose of this test is to detect loose particles inside a device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass that, upon impact with the case, excite the transducer.

    Any noise bursts as detected by any of the three detection systems exclusive of background noise,

except those caused by the shock blows, during the monitoring periods shall be cause for rejection of the device. Rejects shall not be retested except for retest of all devices in the event of test system failure. If additional cycles of testing on a lot are specified, the entire test procedure (equipment setup and checkout mounting, vibration, and co-shocking) shall be repeated for each retest cycle. Reject devices from each test cycle shall be removed from the lot and shall not be retested in subsequent lot testing.

2 Test Objectives

   -  Bonding Chip

   -  Photoelectric Component

   -  Radar Component

   -  RF Module

   -  Acoustic Meter Component

   -  Mix Circuit

   -  Microwave Components

   -  Semiconductor    

   -  COB/SOB

   -  Sensor

3 Test Effect 

   (1) Batch Quality Uniformity Inspection

   (2) Key Process Quality Monitoring

   (3) Delivery Component Inspection and Sampling

   (4) Out of Storage Re-inspection and Sampling

   (5) Daily Inspection or Application Inspection

   (6) Identifying and re-New component Assessment

   (7) Components Reliability Screening and Qualification 

   (8) Quality Analysis and Comparison 

   (9) Control the related process failure mode during Design and Production